Leap Australia Solvia Simufact | Simulating Manufacturing | MSC Software Company Materialise | Innovators you can count on FLOW-3D
Interact with LEAP’s live demonstration of a Simulation-based Digital Twin - built using the award-winning ThingWorx IoT platform and powered by ANSYS Simulation-based ROMs using ANSYS TwinBuilder. SOLVIA SYSTEMS (solvia.com.au) is an authorized partner of Dassault Systemes for software solutions and related services around the Dassault Systemes 3DEXPERIENCE Portfolio for Additive Manufacturing. Simufact Additive is a powerful and scalable simulation environment comprising a best-in-class GUI for the first-time-right optimization of metal AM including heat treatment, cutting the base plate, removing supports and hot isostatic pressing. Our mission is to innovate product development that results in a better and healthier world, through our software and hardware infrastructure, and an in-depth knowledge of Additive Manufacturing.” – Fried Vancraen, CEO of Materialise. FLOW-3D is a highly accurate multiphysics CFD software that simulates AM and laser welding processes for analysis and optimization of process parameters.

A realistic virtual representation - a true digital twin - of the metallic additive manufacturing process will bring huge benefits, but its development presents equally large challenges.


  • $150

    Full registration

  • $75

    Early-career researcher


Tony Murphy

Event date: 04Jul 2019

Thursday 4 Jul 2019

Woodward Conference Centre, Main lecture room, 10th floor, University of Melbourne Law School (Building 106)

185 Pelham St, Carlton VIC
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This one-day symposium will bring together international leaders to answer critical questions, including:

  • What will such a digital twin look like?
  • What are our current capabilities?
  • What do we need to do to bridge the gap?

Metallic additive manufacturing involves layer-by-layer production of components, typically by melting metal powders using a laser or electron beam. Additive manufacturing has many attractive features; e.g. custom-designed components can be produced with geometries not achievable by conventional methods. However, for AM to reach its full potential, a realistic virtual representation of the complete process is required. Such a ‘digital twin’ will accelerate process design and optimisation, and form a key part of process certification and component qualification.

The development of a digital twin presents huge challenges. Not only do accurate and fast computational sub-models of the complex physical and metallurgical processes involved (powder-bed raking, heat transfer and flow in the molten pool, microstructure formation, residual stress development) have to be produced and validated, but they have to be tightly integrated. This is a critical obstacle since the sub-models use different computational approaches and treat vastly different scales, from powder (~50 micrometres) to part (up to metres).

The symposium will bring together leading experts in a diverse range of relevant fields including metallic additive manufacturing, computational modelling, multiscale techniques, structure-property relations, machine learning and artificial intelligence, and digital twins of industrial processes.

Through keynote lectures, poster presentations and facilitated discussion sessions, we aim to

  • Define the requirements for a true digital twin of the additive manufacturing process;
  • Identify the main barriers to developing such software, including those involved in linking sub-models across scales;
  • Explore the physical, metallurgical and computational approaches to overcome these barriers; and
  • Set out a roadmap for the development of a digital twin.

Keynote speakers include:

  • Tarasankar DebRoy, Penn State University, USA
  • Dongdong Gu, Nanjing University of Aeronautics and Astronautics, China
  • Leila Ladani, University of Texas at Arlington, USA
  • Ibo Matthews, Lawrence Livermore National Laboratory, USA
  • Chris Vains, Siemens Australia

The symposium is directed towards researchers, managers, students and others from academia, government and industry.

We especially encourage early-career researchers to attend; the symposium will include a networking session, and we are offering a large number of travel grants for early-career researchers.

The 'Digital Twin' symposium will follow APICAM 2019 (2nd Asia-Pacific International Conference on Additive Manufacturing), to be held in Melbourne from 31 June to 3 July.

We hope to see you in July at the symposium in Melbourne.

Kind Regards,
Tony Murphy

E tony.murphy@csiro.au | T +61 2 9413 7150 | M +61 4 1454 7780